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Part Name
Description
MPXV7002G View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPXV7002G
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Freescale Semiconductor
MPXV7002G Datasheet PDF : 10 Pages
1
2
3
4
5
6
7
8
9
10
-A-
5
N -B-
8
S
J
K
PACKAGE DIMENSIONS
D
8 PL
4
0.25 (0.010)
M
T B
S
A
S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A
0.415 0.425
B
0.415 0.425
C
0.500 0.520
D
0.038 0.042
G
0.100 BSC
H
0.002 0.010
J
0.009 0.011
K
0.061 0.071
M
0˚
7˚
N
0.444 0.448
S
0.709 0.725
V
0.245 0.255
W
0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚
7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPXV7002
5
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