QEB363(2000) View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
QEB363 Datasheet PDF : 4 Pages
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SURFACE MOUNT OPTIONS
T-3/4 PACKAGES
GULL WING LEAD CONFIGURATION
0.166 (4.2)
0.020 (0.51)
0.074 (1.9)
.118 (3.0) 0.078 (2.0)
.102 (2.6)
0.043 (1.1)
0.106 (2.7)
0.091 (2.3)
0.016 (0.4)
ANODE
0.087 (2.2)
0.071 (1.8)
0.024 (0.6)
0.055 (1.4)
0.005 (0.13)
YOKE LEAD CONFIGURATION
0.098 (2.5)
0.283 (7.2)
0.020 (0.5)
0.074 (1.9)
ANODE
0.087 (2.2)
0.071 (1.8)
0.016 (0.4)
0.118 (3.0)
0.102 (2.6)
0.031 (0.8)
0.051 (1.3)
0.043 (1.1)
0.141 (3.6)
0.055 (1.4)
0.008 (0.2)
FEATURES
• Three lead forming options: Gull Wing, Yoke and Z-Bend
• Compatible with automatic placement equipment
• Supplied on tape and reel or in bulk packaging
• Compatible with vapor phase reflow solder processes
NOTES: (Applies to all package drawings)
1. Dimensions are in inches (mm).
2. Tolerance of ± .010 (.25) on all non nominal dimensions
unless otherwise specified.
Z-BEND LEAD CONFIGURATION
0.127 (3.25)
0.112 (2.85)
0.236 (6.0)
0.220 (5.6)
0.177 (4.5)
0.161 (4.1)
0.016 (0.4)
0.020 (0.5)
0.074 (1.9)
ANODE
0.087 (2.2)
0.071 (1.8)
.118 (3.0) 0.080 (2.0)
.102 (2.6)
0.043 (1.1)
0.106 (2.7)
0.091 (2.3)
0.024 (0.6)
0.031 (0.8) 0.055 (1.4)
3 of 4
100007C
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