1 Mbit SPI Serial Flash
SST25VF010
PACKAGING DIAGRAMS
Data Sheet
Pin #1
Identifier
TOP VIEW
SIDE VIEW
7˚
4 places
0.51
5.0
0.33
4.8
1.27 BSC
END VIEW
45˚
0.25
0.10
4.00
3.80
1.75
6.20
1.35
0.25
5.80
0.19
Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.
8-LEAD SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)
SST PACKAGE CODE: SA
08-soic-5x6-SA-8
1mm
7˚
4 places
0˚
8˚
1.27
0.40
©2003 Silicon Storage Technology, Inc.
21
S71233-01-000
8/03