Tp
TL
Ts max
Ts min
ts
Preheat
Ramp-up
tp
tL
Ramp-down
25
t 25oC to Peak
Time
Figure 23. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Critical Zone
T L to Tp
Table 8. Typical SMT Reflow Profile for Maximum Temperature = 260+0 / -5°C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (TL)
Peak temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C /sec max
6 min max.
Pb-Free Solder
3°C /sec max
150°C
200°C
60-180 sec
3°C /sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C /sec max
8 min max.
15