EMIF01-1003M3
4
Package information
Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
Table 3.
SOT-883 dimensions
E
D
L
2
b
e
1
A
A1
L1
3 b1
e1
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.45
0.50 0.18
0.2
A1 0.00
0.05 0.00
0.02
b 0.10 0.15 0.20 0.04 0.06 0.08
b1 0.45 0.50 0.55 0.18 0.20 0.22
D
0.60
0.24
E
1.00
0.39
e
0.35
0.14
e1
0.65
0.26
L 0.20 0.25 0.30 0.08 0.10 0.12
L1 0.20 0.25 0.30 0.08 0.10 0.12
Figure 9.
Footprint (dimensions in mm) Figure 10. Marking
0.40
0.40
2
0.20
0.15
0.40
0.50
F
3
1
5/10