Philips Semiconductors
Silicon temperature sensors
Product specification
KTY81-2 series
PACKAGING
Sensors in SOD70 encapsulation are delivered in bulk packaging, and also reel packaging for automatic placement on
hybrid circuits and printed-circuit boards (see Figs 7 and 8).
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres. The lead-to-lead distance of types
packaged on reel is 5.08 millimetres for spread lead types and 2.54 millimetres for straight lead types.
handbook, full pagewidth
H1
H0
L
P
A1
A
H2
T
(p)
∆h
∆h
W2
W0 W1
W
F1
F2
D0
F
P2
P0
MBH795
t1
t
Fig.7 Configuration of bandolier: spread leads.
2000 Aug 25
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