Advance Product Information
July 26, 2007
TGA2513-SM
Recommended Board Layout Assembly
1uF 1206
capacitor
5 ohm 0603
resistor
100pF 0402
capacitor
Recommended Bias-up Procedure
1. Ensure no RF power is applied to the device
2. Pinch-off device by setting Vg (Vg1) to -1V
3. Increase Vd to 5V while monitoring gate current
4. Increase Vc (Vg2) to 2V
5. Increase Vg (Vg1) until drain current reaches 75 mA
6. Apply RF Power
Recommended Bias-Down Procedure
1. Turn off RF power
2. Decrease Vg (Vg1) to -1V
3. Decrease Vc (Vg2) to 0 V
4. Decrease Vd to 0 V
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com