TDA1517ATW View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
TDA1517ATW Datasheet PDF : 19 Pages
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NXP Semiconductors
8 W BTL or 2 × 4 W SE power amplifier
Product specification
TDA1517ATW
FEATURES
• Requires very few external components
• Flexibility in use: mono Bridge-Tied Load (BTL) and
stereo Single-Ended (SE); it should be noted that in
stereo applications the outputs of both amplifiers are in
opposite phase
• High output power
• Low offset voltage at output (important for BTL)
• Fixed gain
• Good ripple rejection
• Mode select switch (operating, mute and standby)
• AC and DC short-circuit safe to ground and VP
• Electrostatic discharge protection
• Thermal protection
• Reverse polarity safe
• Capable of handling high energy on outputs (VP = 0 V)
• No switch-on/switch-off plop
• Low thermal resistance.
GENERAL DESCRIPTION
The TDA1517ATW is an integrated class-AB output
amplifier contained in a plastic heatsink thin shrink small
outline package (HTSSOP20). The device is primarily
developed for multimedia applications.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VP
IORM
Iq(tot)
Istb
supply voltage
repetitive peak output current
total quiescent current
standby current
SE application
Po
SVRR
output power
supply voltage ripple rejection
αcs
Vn(o)
⎪Zi⎪
channel separation
noise output voltage
input impedance
BTL application
Po
SVRR
output power
supply voltage ripple rejection
⎪ΔVOO⎪
Vn(o)(offset)
⎪Zi⎪
output offset voltage
noise output offset voltage
input impedance
CONDITIONS
THD = 10%; RL = 4 Ω
RS = 0 Ω
RS = 10 kΩ
RS = 0 Ω
THD = 10%; RL = 8 Ω
RS = 0 Ω
RS = 0 Ω
MIN.
6
−
−
−
TYP.
12
−
40
0.1
MAX. UNIT
18
V
2.5 A
80
mA
100 μA
−
4
−
W
46
−
−
dB
40
55
−
dB
−
50
−
μV
50
−
−
kΩ
−
8
−
W
50
−
−
dB
−
−
150 mV
−
70
−
μV
25
−
−
kΩ
ORDERING INFORMATION
TYPE
NUMBER
TDA1517ATW
NAME
HTSSOP20
PACKAGE
DESCRIPTION
plastic thermal enhanced thin shrink small outline package;
20 leads; body width 4.4 mm; exposed die pad
VERSION
SOT527-1
2001 Apr 17
2
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