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CPD74 Datasheet - Central-Semiconductor

Part Name
Description
MFG CO.
Other PDF
  2004  
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CPD74 image

PROCESS DETAILS
   Die Size 25 x 25 MILS
   Die Thickness 6.0 MILS
   Anode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
   Cathode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
   Top Side Metalization Al - 12,000Å
   Back Side Metalization Au - 5,000Å

 

Part Name
Description
PDF
MFG CO.
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