ASSEMBLY GUIDELINES FOR 8X8 MLP DRIVERMOS PACKAGING Datasheet PDF

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Part Name(s) : AN-9037

Fairchild Semiconductor

Description : Assembly Guidelines for 8x8 MLP DriverMOS Packaging

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Part Name(s) : AN-9048

Fairchild Semiconductor

Description : Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging

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Part Name(s) : AN-9040

Fairchild Semiconductor

Description : Assembly Guidelines for Power33 Packaging

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Part Name(s) : AN-9046 AN9046

Fairchild Semiconductor

Description : Assembly Guidelines for Dual Power56 Packaging

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Part Name(s) : FAN5350 FAN5350UCX FAN5350MPX

Fairchild Semiconductor

Description : 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging (Rev - 2007)

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Part Name(s) : FAN5350 FAN5350UCX FAN5350MPX

ON Semiconductor

Description : 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging

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Part Name(s) : AN644

Silicon Laboratories

Description : Si477X LAYOUT Guidelines

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Part Name(s) : FAN5350 FAN5350UCX FAN5350MPX

Fairchild Semiconductor

Description : 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging

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Part Name(s) : CPD_ EMD2_ EMD3_ EMD4_ EMD5_ GMD2_ HMD12_ HMD8_ LLDS_ LPDS_

ROHM Semiconductor

Description : Packaging specifications

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Part Name(s) : GP10E

Vishay Semiconductors

Description : Packaging Information

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Part Name(s) : DO-204AC DO-204AL DO201AD GP10-E GP20 MPG06 P300 P600 RGP10-E

Vishay Semiconductors

Description : Packaging Information

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Part Name(s) : M513

M/A-COM Technology Solutions, Inc.

Description : Tape and Reel Packaging for Surface Mount Components

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Part Name(s) : ADXL363 ADXL363BCCZ-RL ADXL363BCCZ-RL7 EVAL-ADXL363Z EVAL-ADXL363Z-MLP EVAL-ADXL363Z-S

Analog Devices

Description : Micropower 3-Sensor Combination Including Acceleration and Temperature (Rev - Rev0)

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Part Name(s) : ADXL363 ADXL363BCCZ-RL ADXL363BCCZ-RL7 EVAL-ADXL363Z EVAL-ADXL363Z-MLP EVAL-ADXL363Z-S

Analog Devices

Description : Micropower 3-Sensor Combination Including Acceleration and Temperature

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Part Name(s) : HP6-189S-1.27DS HP5-189P-1.27W HP5-189PB-1.27W HP5-123P-1.27W HP5-75P-1.27W HP5-189P-1.27DS HP5-189S-1.27DS HP5-189PB-1.27DS HP5-123P-1.27DS HP5-75P-1.27DS

HIROSE ELECTRIC

Description : High-density Packaging System

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Part Name(s) : ICM-0805 ICM-1206 ICM-2824 ICM-3528 ICM-4743 IFCB-0402 ILAS-1206 ILB-1206 ILBB-0402 ILBB-0603

Vishay Semiconductors

Description : SMD Magnetics Packaging Methods

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Part Name(s) : NCP1450A NCP1500 NCP1500_06 NCP1501 NTLJF117P NTLJF156N NTLJS4159N NTLTS3107P NTZD3151P NCP1510A

ON Semiconductor

Description : Low Profile, Small Footprint Packaging

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Part Name(s) : GMA2488C GMA2888C GMA2988C GMC2888C GMC2988C GMC2488C GMC2688C

QT Optoelectronics => Fairchildsemi

Description : 2.3 8x8 DOT MATRIX DISPLAYS

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Part Name(s) : 1088AS

Unspecified

Description : LED 8x8 matrix 3mm 1088AS

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Part Name(s) : ADXL362 ADXL362BCCZ-RL ADXL362BCCZ-RL7 ADXL362BCCZ-R2 EVAL-ADXL362Z EVAL-ADXL362Z-DB EVAL-ADXL362Z-MLP EVAL-ADXL362Z-S

Analog Devices

Description : Micropower, 3-Axis, ±2 g/±4 g/±8 g Digital Output MEMS Accelerometer

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