AD8591/AD8592/AD8594
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 47. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8591ART-REEL
AD8591ART-REEL7
AD8591ARTZ-REEL1
AD8591ARTZ-REEL71
AD8592ARM-REEL
AD8592ARMZ-REEL1
AD8594AR
AD8594AR-REEL
AD8594AR-REEL7
AD8594ARZ1
AD8594ARZ-REEL1
AD8594ARZ-REEL71
AD8594ARU-REEL
AD8594ARUZ-REEL1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
10-Lead MSOP
10-Lead MSOP
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead SOIC_N
16-Lead TSSOP
16-Lead TSSOP
1 Z = RoHS Compliant Part, # denotes RoHS compliant part may be top or bottom marked.
Package Option
RJ-6
RJ-6
RJ-6
RJ-6
RM-10
RM-10
R-16
R-16
R-16
R-16
R-16
R-16
RU-16
RU-16
Branding
A9A
A9A
A9A#
A9A#
AQA
AQA#
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01106-0-1/09(B)
Rev. B | Page 16 of 16