HCTS541D View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

HCTS541D

Radiation Hardened Non-Inverting Octal Buffer/Line Driver, Three-State

Intersil 

Die Characteristics

DIE DIMENSIONS:

101 x 85 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS541MS

HCTS541MS

A1 (3)

A2 (4)

A3 (5)

A4 (6)

A5 (7)

A6 (8)

(18) Y0

(17) Y1

(16) Y2

(15) Y3

(14) Y4

(13) Y5

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS541 is TA14456A.

Spec Number 518630

691

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