HCTS32K View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

HCTS32K

Radiation Hardened Quad 2-Input OR Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20 x 2.2mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

B1 (2)

HCTS32MS

HCTS32MS

A1

VCC

B4

(1)

(14)

(13)

Y1 (3)

A2 (4)

B2 (5)

(6)

(7)

(8)

Y2

GND

Y3

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518638

457

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