POLYFUSEĀ® Resettable PTCs
Radial Leaded > 30R Series
Soldering Parameters - Wave Soldering
Pre-Heating Zone
Soldering Zone
Cooling Zone
Refer to the condition recommended
by the ļ¬ux manufacturer.
Max. ramping rate should not exceed
4Ā°C/Sec.
Max. solder temperature should not
exceed 260Ā°C
Cooling by natural convection in air.
Soldering
260
220
Preheating
190
160
Cooling
Physical Speciļ¬cations
Lead Material
0.90-2.50A: Tin-plated Copper clad steel
3.00-9.00A: Tin-plated Copper
Soldering
Characteristics
Solderability per MILāSTDā202,
Method 208E
Insulating Material
Cured, ļ¬ame retardant epoxy polymer
meets UL94V-0 requirements.
Device Labeling
Marked with āLFā, voltage, current rating,
and date code.
0
60 min.
5 max.
Time(s)
Environmental Speciļ¬cations
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
-40Ā°C to +85Ā°C
125Ā°C
+85Ā°C, 1000 hours
-/+5% typical resistance
change
+85Ā°C, 85% R.H., 1000 hours
-/+5% typical resistance
change
+85Ā°C to -40Ā°C 10 times
-/+5% typical resistance
change
MILāSTDā202, Method 215F
No change
Moisture Resistance Level
Level 2, JāSTDā020C
Ā©2008 Littelfuse, Inc.
Speciļ¬cations are subject to change without notice.
Please refer to www.littelfuse.com/series/30R.html for current information.
Revised: October 24, 2008
30R Series