Communication ICs
BA6569AS / BA6569AFP
FOperation notes
The maximum power dissipation for the BA6569AS is
1100mW, and for the BA6569AFP, the maximum power
dissipation is 1200mW (when mounted on 90mm
50mm 1.6mm glass epoxy boards, however, fins
should be soldered to the foil pattern). Since the maxi-
mum power dissipation varies with temperature, the
product of the applied voltage VL and the total current
drawn by the IC, after factoring in the temperature,
should not exceed the maximum dissipation.
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