LF-to-2.5GHz Dual Logarithmic Detector/
Controller for Power, Gain, and VSWR Measurements
planes. This method provides a good RF/thermal con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX2016 Evaluation Kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin with a
capacitor as close to the pin as possible (Typical
Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX2016’s 28-pin thin
QFN-EP package provides two functions. One is a low
thermal-resistance path to the die; the second is a low-
RF impedance ground connection. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes (minimum of four
holes to provide ground integrity).
Functional Diagram
2, 9, 12, 20 VCC
5, 17
GND
20kΩ
26
27
25
SETA
OUTA
REF
20kΩ
2.0V
REF
23
24
OUTB SETB
20kΩ
20kΩ
3 RFINA+
4 RFINA-
1 FA1
28 FA2
LOG
50Ω
AMPLIFIERS
COR
8
LOG
AMPLIFIERS
50Ω
EXPOSED
PAD
RFINB+ 19
RFINB- 18
FB1 21
FB2 22
MAX2016
20kΩ
FV1 14
FV2 13
CSETH COUTH
7
6
COUTL
16
CSETL
15
OUTD SETD
11 10
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