MPXH6101A View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPXH6101A Datasheet PDF : 12 Pages
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-A-
5
N -B-
8
S
J
K
PACKAGE DIMENSIONS
D 8 PL
4
0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M 0˚
7˚
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚
7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
C
B
J
S
M
-A-
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE
(P1)
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
PIN 1
SEATING
PLANE
-T-
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M
30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
Sensors
Freescale Semiconductor
MPX4101A
7
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