MT48LC16M16A2BG-75(2005) View Datasheet(PDF) - Micron Technology
Part Name
Description
Manufacturer
MT48LC16M16A2BG-75 Datasheet PDF : 61 Pages
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256Mb: x4, x8, x16
SDRAM
Figure 55: VFBGA “FG” Package, 54-ball, 8mm x 14mm
x16
0.65 ±0.05
SEATING PLANE
C
0.10 C
6.40
54X Ø0.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
BALL A9
6.40
3.20 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
1.00 MAX
0.80 TYP
CL
14.00 ±0.10
7.00 ±0.05
BALL A1 ID
3.20 ±0.05 CL
4.00 ±0.05
8.00 ±0.10
(Bottom View)
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
NOTE: 1. All dimensions in millimeters.
2. Recommended Pad size for PCB is 0.4mm±0.065mm.
3. Top side part marking decode can be found at:
http://www.micron.com/products/fbga/FBGA.asp
DATA SHEET DESIGNATION
Production: This data sheet contains minimum and maximum limits specified over the complete power supply
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
PDF: 09005aef8091e6d1/Source: 09005aef8091e6a8
256MSDRAM.pmd – Rev. H; Pub. 2/05
61
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
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