MT48LC16M16A2BB-6A(2007) View Datasheet(PDF) - Micron Technology
Part Name
Description
Manufacturer
MT48LC16M16A2BB-6A Datasheet PDF : 77 Pages
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Figure 57: 54-Ball VFBGA “FG” Package, 8mm x 14mm (x16)
0.65 ±0.05
256Mb: x4, x8, x16 SDRAM
Package Dimensions
SEATING PLANE
C
0.10 C
6.40
54X Ø0.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
BALL A9
6.40
3.20 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
1.00 MAX
0.80 TYP
CL
14.00 ±0.10
7.00 ±0.05
BALL A1 ID
3.20 ±0.05 CL
4.00 ±0.05
8.00 ±0.10
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø 0.40
Notes:
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.065mm.
3. Topside part marking decode can be found at: http://www.micron.com/decoder.
®
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
set forth herein. Although considered final, these specifications are subject to change, as further product development and
data characterization sometimes occur.
PDF: 09005aef8091e6d1/Source: 09005aef8091e6a8
256MSDRAM_2.fm - Rev. L 10/07 EN
77
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1999 Micron Technology, Inc. All rights reserved.
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