FH25-21S-0.3SH View Datasheet(PDF) - HIROSE ELECTRIC

Part Name

Description

Manufacturer

FH25-21S-0.3SH

0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors.

HIROSE ELECTRIC 

BRecommended PCB mounting pattern and metal mask dimensions

0.3

FULL R

A

H

∞Number of contacts

0.1 H

0.3±0.05 (Land)

0.25±0.05(Metal mask)

Recommended metal mask thickness:

t = 0.1 mm

0.4±0.03

B±0.05

BRecommended FPC Dimensions

C±0.05

A±0.03

0.6±0.02

0.3±0.07

(0.05)

(0.2)

0.4±0.03

0.3

+0.04

- 0.03

2-R0.2 MAX

0.2±0.03

0.3±0.02

0.6±0.02

D±0.03

0.3

+0.04

- 0.03

(0.6)

0.6±0.07

Covering film layer

1 Polyamide and thermally hardening adhesive is recommended as the stiffener materials.

2 Overlap between covering film layer and stiffener is 0.5mm min.

Part Number

CL No.

Number of Contacts

A

B

FH25-21S-0.3SH(05)

CL586-1204-3-05

21

6.0

7.2

FH25-27S-0.3SH(05)

CL586-1205-6-05

27

7.8

9.0

FH25-33S-0.3SH(05)

CL586-1207-1-05

33

9.6

10.8

FH25-39S-0.3SH(05)

CL586-1208-4-05

39

11.4

12.6

FH25-45S-0.3SH(05)

CL586-1209-7-05

45

13.2

14.4

FH25-51S-0.3SH(05)

CL586-1200-2-05

51

15.0

16.2

Embossed tape reel packaging (5,000 pieces/reel).

Order by number of reels.

Unit: mm

C

D

6.6

5.4

8.4

7.2

10.2

9.0

12.0

10.8

13.8

12.6

15.6

14.4

5

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