Step-Up Converter
for Handheld Applications
TOP VIEW
(BUMP SIDE DOWN)
MAX8969
1
2
3
+
A OUT1 OUT2
IN
B LX1
LX2
EN
C GND1 GND2 TREN
WLP
(1.25mm × 1.25mm)
Pin Configuration
Pin Description
PIN
NAME
FUNCTION
A1
OUT1
Power Output. Bypass OUT_ to ground with a 22FF rated ceramic capacitor. For optimal
performance place the ceramic capacitor as close as possible to OUT_. OUT1 and OUT2
should be shorted together directly under the IC. In True Shutdown, the output voltage can fall
A2
OUT2
to 0V, but OUT_ has a diode with its cathode connected to IN. See Figure 3.
A3
IN
Input Supply Voltage. Bypass IN to GND_ with a 4.7FF ceramic capacitor. A larger
capacitance may be required to reduce noise.
B1
LX1
Converter Switching Node. Connect a 1FH inductor from LX_ to IN. LX_ is high impedance in
B2
LX2
shutdown. LX1 and LX2 should be shorted together directly under the IC.
Enable Input. Drive EN logic-high to enable boost mode, regardless of the logic level of TREN.
B3
EN
Connect EN to ground or drive logic-low to allow TREN to select either True Shutdown or track
mode. See Table 1.
C1
GND1
Ground. Connect GND_ to a large ground plane. GND1 and GND2 should be shorted together
C2
GND2
directly under the IC.
C3
TREN
Track Enable Input. Drive TREN logic-high to enable track mode. Connect TREN to ground or
drive logic-low to place the IC in True Shutdown. See Table 1.
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