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AD8276 View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
AD8276 Datasheet PDF : 20 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Maximum Voltage at Any Input Pin
Minimum Voltage at Any Input Pin
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (TG)
Rating
±18 V
−VS + 40 V
+VS − 40 V
−65°C to +150°C
−40°C to +85°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The θJA values in Table 5 assume a 4-layer JEDEC standard
board with zero airflow.
Table 5.
Package Type
8-Lead MSOP
8-Lead SOIC
14-Lead SOIC
θJA
Unit
135
°C/W
121
°C/W
105
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8276/AD8277
is limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the properties of the plastic change. Even temporarily
exceeding this temperature limit may change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a temperature of 150°C
for an extended period may result in a loss of functionality.
AD8276/AD8277
2.0
TJ MAX = 150°C
1.6
14-LEAD SOIC
θJA = 105°C/W
1.2
8-LEAD SOIC
θJA = 121°C/W
0.8
8-LEAD MSOP
θJA = 135°C/W
0.4
0
–50 –25
0
25
50
75
100 125
AMBIENT TEMERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
SHORT-CIRCUIT CURRENT
The AD8276/AD8277 have built-in, short-circuit protection
that limits the output current (see Figure 25 for more information).
While the short-circuit condition itself does not damage the
part, the heat generated by the condition can cause the part to
exceed its maximum junction temperature, with corresponding
negative effects on reliability. Figure 3 and Figure 25, combined
with knowledge of the supply voltages and ambient temperature of
the part, can be used to determine whether a short circuit will
cause the part to exceed its maximum junction temperature.
ESD CAUTION
Rev. C | Page 5 of 20

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