Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Input Voltage
Input Current1
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Maximum Reflow Temperature (MSL1 Rating)2
Lead Temperature, Soldering (10 sec)
Electrostatic Discharge (ESD)
Human Body Model (HBM)3
Field Induced Charge Device Model (FICDM)4
Rating
36 V
±VSY
±10 mA
±VSY
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
260°C
300°C
6 kV
1.25 kV
1 The input pins have clamp diodes to the power supply pins and to each
other. Limit the input current to 10 mA or less whenever input signals
exceed the power supply rail by 0.3 V.
2 IPC/JEDEC J-STD-020 applicable standard.
3 ESDA/JEDEC JS-001-2011 applicable standard.
4 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ADA4077-1/ADA4077-2/ADA4077-4
THERMAL RESISTANCE
θJA is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
8-Lead MSOP
190
44
8-Lead SOIC
158
43
14-Lead TSSOP
240
43
14-Lead SOIC
115
36
Unit
°C/W
°C/W
°C/W
°C/W
ESD CAUTION
Rev. E | Page 7 of 27