AD6657A View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD6657A Datasheet PDF : 36 Pages
| |||
AD6657A
Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
A1 BALL
CORNER
10.10
10.00 SQ
9.90
8.80
BSC SQ
0.80
TOP VIEW
0.60
REF
12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
BOTTOM VIEW
A1 BALL
CORNER
*1.40 MAX
DETAIL A
DETAIL A
0.65 MIN
0.25 MIN
SEATING
PLANE
0.50
COPLANARITY
0.45
0.20
0.40
BALL DIAMETER
*COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1
WITH EXCEPTION TO PACKAGE HEIGHT.
Figure 61. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD6657ABBCZ
AD6657ABBCZRL
AD6657AEBZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
BC-144-1
BC-144-1
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09684-0-2/14(A)
Rev. A | Page 36 of 36
www.analog.com/AD6657A
Share Link: 