AD7983 View Datasheet(PDF) - Analog Devices
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Description
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AD7983 Datasheet PDF : 25 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Analog Inputs
IN+, IN− to GND1
Supply Voltage
REF, VIO to GND
VDD to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
Storage Temperature Range
Junction Temperature
Lead Temperature
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.3 V to VREF + 0.3 V or ±130 mA
−0.3 V to +6 V
−0.3 V to +3 V
+3 V to −6 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
215°C
220°C
1 See the Analog Inputs section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD7983
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 7. Thermal Resistance
Package Type1
θJA
θJC
Unit
RM-10
200
44
°C/W
CP-10-9
48.7
2.96
°C/W
1 Test Condition 1: thermal impedance simulated values are based on use of a
2S2P JEDEC PCB. See the Ordering Guide.
ESD CAUTION
Rev. C | Page 7 of 25
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