ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to PGND
DVDDIO to DGND
CVDD to CGND
TVDD to TGND
DVDDIO to AVDD
DVDDIO to TVDD
DVDDIO to DVDD
CVDD to DVDD
PVDD to DVDD
AVDD to CVDD
AVDD to PVDD
AVDD to DVDD
AVDD to TVDD
TVDD to DVDD
Digital Inputs
Voltage to DGND
Digital Outputs
Voltage to DGND
Analog Inputs
Voltage to AGND
Maximum Junction
Temperature (TJ_MAX)
Storage Temperature Range
Infrared Reflow,
Soldering (20 sec)
Rating
2.2 V
2.2 V
2.2 V
4V
2.2 V
4V
−0.3 V to +3.6 V
−3.6 V to +3.6 V
−2 V to +2 V
−2 V to +0.3 V
−2 V to +0.3 V
−2 V to +2 V
−2 V to +2 V
−2 V to +2 V
−3.6 V to +0.3 V
−2 V to +2 V
DGND − 0.3 V to DVDDIO + 0.3 V
DGND − 0.3 V to DVDDIO + 0.3 V
AGND − 0.3 V to AVDD + 0.3 V
119°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 5.
Package Type
ΨJT1
144-Lead LQFP (ST-144)
1.62
1 Junction-to-package surface thermal resistance.
Unit
°C/W
AD9388A
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during AD9388A operation,
turn off unused ADCs.
On a 4-layer PCB that includes a solid ground plane, the θJA
value is 25.3°C/W. However, due to variations within the PCB
metal and, therefore, variations in PCB heat conductivity, the
value of θJA may differ for various PCBs.
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature
because it is not affected by the variance associated with the
θJA value.
The maximum junction temperature (TJ_MAX) of 119°C must not
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on the
device under test:
TJ_MAX = TS + (ΨJT × WTOTAL)
where:
TS is the surface temperature of the package expressed in
degrees Celsius.
ΨJT is the junction-to-package surface thermal resistance.
WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO ×
IDVDDIO) + (PVDD × IPVDD) + (CVDD × ICVDD) + (TVDD × ITVDD)}
The AD9388A can be operated in ambient temperatures up to
+85°C. However, in video modes where highest power is consumed
and there is higher than nominal power supply voltages and worst-
case video data, operation at these ambient temperatures may
cause the junction temperature to exceed its maximum allowed
value (119°C). One way to avoid this is to restrict the ambient
temperature to be below +79°C. However, even if the ambient
temperature is kept below +79°C, the user still needs to observe
the thermally efficient PCB design recommendations outlined
in this section to ensure that the maximum allowed junction
temperature is not exceeded in any video mode.
Contact an Analog Devices, Inc., representative or field appli-
cations engineer (FAE) for more details on package thermal
performance.
ESD CAUTION
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