AD9388ABSTZ-5P View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9388ABSTZ-5P Datasheet PDF : 28 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to PGND
DVDDIO to DGND
CVDD to CGND
TVDD to TGND
DVDDIO to AVDD
DVDDIO to TVDD
DVDDIO to DVDD
CVDD to DVDD
PVDD to DVDD
AVDD to CVDD
AVDD to PVDD
AVDD to DVDD
AVDD to TVDD
TVDD to DVDD
Digital Inputs
Voltage to DGND
Digital Outputs
Voltage to DGND
Analog Inputs
Voltage to AGND
Maximum Junction
Temperature (TJ_MAX)
Storage Temperature Range
Infrared Reflow,
Soldering (20 sec)
Rating
2.2 V
2.2 V
2.2 V
4V
2.2 V
4V
−0.3 V to +3.6 V
−3.6 V to +3.6 V
−2 V to +2 V
−2 V to +0.3 V
−2 V to +0.3 V
−2 V to +2 V
−2 V to +2 V
−2 V to +2 V
−3.6 V to +0.3 V
−2 V to +2 V
DGND − 0.3 V to DVDDIO + 0.3 V
DGND − 0.3 V to DVDDIO + 0.3 V
AGND − 0.3 V to AVDD + 0.3 V
125°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9388A
THERMAL RESISTANCE
Table 5.
Package Type
ΨJT1
144-Lead LQFP (ST-144)
1.62
1 Junction-to-package surface thermal resistance.
Unit
°C/W
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during AD9388A operation,
turn off unused ADCs.
On a four-layer PCB that includes a solid ground plane, the θJA
value is 25.3°C/W. However, due to variations within the PCB
metal and, therefore, variations in PCB heat conductivity, the
value of θJA may differ for various PCBs.
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature
because this is not affected by the variance associated with the
θJA value.
The maximum junction temperature (TJ_MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on DUT:
TJ_MAX = TS + (ΨJT × WTOTAL)
where:
TS is the surface temperature of the package expressed in
degrees Celsius.
ΨJT is the junction-to-package surface thermal resistance.
WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO
× IDVDDIO) + (PVDD × IPVDD) + (CVDD × ICVDD) +
(TVDD × ITVDD)}.
Contact an Analog Devices, Inc., representative for more details
on package thermal performance at video.products@analog.com.
ESD CAUTION
Rev. B | Page 9 of 28
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