ADA4853-1 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADA4853-1

Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power Disable

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Supply Voltage

Power Dissipation

Common-Mode Input Voltage

Differential Input Voltage

Storage Temperature Range

Operating Temperature Range

6-Lead SC70

16-Lead LFCSP_VQ

14-Lead TSSOP

Lead Temperature

Junction Temperature

Rating

5.5 V

See Figure 6

−VS − 0.2 V to +VS − 1.2 V

±VS

−65°C to +125°C

−40°C to +85°C

−40°C to +105°C

−40°C to +105°C

JEDEC J-STD-20

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for the device soldered in the circuit board for surface-

mount packages.

Table 4.

Package Type

6-Lead SC70

16-Lead LFCSP_VQ

14-Lead TSSOP

θJA

Unit

430

°C/W

63

°C/W

120

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4853-1/

ADA4853-2/ADA4853-3 is limited by the associated rise in

junction temperature (TJ) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature limit

can change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

amplifiers. Exceeding a junction temperature of 150°C for an

extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

ADA4853-1/ADA4853-2/ADA4853-3

The power dissipated in the package (PD) for a sine wave and a

resistor load is the total power consumed from the supply

minus the load power.

PD = Total Power Consumed − Load Power

( ) PD = VSUPPLY VOLTAGE × ISUPPLY CURRENT

– VOUT 2

RL

RMS output voltages should be considered.

Airflow increases heat dissipation, effectively reducing θJA.

In addition, more metal directly in contact with the package

leads and through holes under the device reduces θJA.

Figure 6 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 6-lead SC70

(430°C/W), the 14-lead TSSOP (120°C/W), and the 16-lead

LFCSP_VQ (63°C/W) on a JEDEC standard 4-layer board. θJA

values are approximations.

3.0

2.5

2.0

1.5

TSSOP

1.0

LFCSP

0.5

SC70

0

–55 –35 –15 5

25 45 65 85 105 125

AMBIENT TEMPERATURE (°C)

Figure 6. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

Rev. B | Page 5 of 16

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