ADP1706(RevA) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADP1706 Datasheet PDF : 20 Pages
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ADP1706/ADP1707/ADP1708
Data Sheet
EN 1
GND 2
IN 3
IN 4
ADP1708
TOP VIEW
(Not to Scale)
8 ADJ
7 SENSE
6 OUT
5 OUT
NOTES
1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
ON THE BOARD.
Figure 8. 8-Lead SOIC, ADP1708
EN 1
GND 2
IN 3
IN 4
ADP1708
TOP VIEW
(Not to Scale)
8 ADJ
7 SENSE
6 OUT
5 OUT
NOTES
1. EXPOSED PAD. THE EXPOSED PAD ENHANCES THERMAL PERFORMANCE
AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS
RECOMMENDED TO CONNECT THE EXPOSED PAD TO THE GROUND PLANE
ON THE BOARD.
Figure 9. 8-Lead LFCSP, ADP1708
Table 6. ADP1708 Pin Function Descriptions
Pin No.
SOIC LFCSP Mnemonic Description
1
1
EN
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic
startup, connect EN to IN.
2
2
GND
Ground.
3, 4 3, 4 IN
Regulator Input Supply. Bypass IN to GND with a 4.7 μF or greater capacitor.
5, 6 5, 6 OUT
Regulated Output Voltage. Bypass OUT to GND with a 4.7 μF or greater capacitor.
7
7
SENSE
Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as
close as possible to the load to minimize the effect of IR drop between the regulator output and the load.
8
8
ADJ
Adjust. A resistor divider from OUT to ADJ sets the output voltage.
0
0
EP
Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside
the package. It is recommended to connect the exposed pad to the ground plane on the board.
Rev. A | Page 8 of 20
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