ADP2386
OUTLINE DIMENSIONS
Data Sheet
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.30
0.25
0.20
0.20 MIN
0.20
MIN
19
18
2.80
2.70
2.60
EXPOSED
PAD
0.20
MIN
24
1
PIN 1
INDICATOR
1.50
1.40
1.30 0.45
0.35
0.50
BSC
0.50
0.40
0.30
EXPOSED
PAD
13
6
12
7
BOTTOM VIEW
0.25
1.05
0.95
0.85
0.20
MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD .
Figure 40. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
ADP2386ACPZN-R7 −40°C to +125°C
ADP2386-EVALZ
ADP2386BB-EVALZ
Package Description
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 7” Tape and Reel
Evaluation Board
Inverting Buck-Boost Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
CP-24-12
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D10211-0-10/15(C)
Rev. C | Page 24 of 24