B32021 ... B32026
Y2 / 300 V AC
Testing and Standards
Test
Reference
Conditions of test
Electrical
Parameters
Robustness of
terminations
Resistance to
soldering heat
IEC 60384-14
IEC 60068-2-21
IEC 60068-2-20,
test Tb,
method 1A
Voltage Proof:
Between terminals,
1500 V AC, 1 min.
Terminals and enclosure: 2 VR +
1500 V AC
Insulation resistance, RINS
Capacitance, C
Dissipation factor, tan δ
Tensile strength (test Ua1)
Wire diameter
Tensile
force
0.5 < d1 ≤ 0.8 mm 10 N
0.8 < d1 ≤ 1.25 mm 20 N
Solder bath temperature at
260 ± 5 °C, immersion for
10 seconds
Rapid change of IEC 60384-16
temperature
TA = lower category temperature
TB = upper category temperature
Five cycles, duration t = 30 min.
Performance
requirements
Within specified limits
Capacitance and tan δ
within specified limits
∆C/C0 ≤ 5%
tan δ within specified
limits
No visible damage
I∆C/C0 I ≤ 5%
tan δ within specified
limits
Vibration
Bump
Climatic
sequence
IEC 60384-14
IEC 60384-14
IEC 60384-14
Test FC: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
Test Eb: Total 4000 bumps with
400 m/s2 mounted on PCB
6 ms duration
Dry heat TB / 16 h.
Damp heat cyclic, 1st cycle
+ 55 °C / 24h / 95% ... 100% RH
Cold TA / 2h
Damp heat cyclic, 5 cycles
+ 55 °C / 24h / 95% ... 100% rh
No visible damage
No visible damage
I∆C/C0 I ≤ 5%
tan δ within specified
limits
No visible damage
I∆C/C0 I ≤ 5%
I∆ tan δ I ≤ 0.008,
C ≤ 1 µF
I∆ tan δ I > 0.005,
C > 1 µF
Voltage proof
RINS ≥ 50% of initial limit
Please read Cautions and warnings and
Important notes at the end of this document.
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