BA2902YFV-CE2 View Datasheet(PDF) - ROHM Semiconductor

Part Name

Description

Manufacturer

BA2902YFV-CE2

Automotive Ground Sense Operational Amplifiers

ROHM Semiconductor 

BA2904Yxxx-C, BA2902Yxx-C

Datasheet

●Operational Notes

1) Unused circuits

When there are unused circuits, it is recommended that they are

connected as in Figure .56, setting the non-inverting input terminal to a

potential within the in-phase input voltage range (Vicm).

2) Input voltage

Applying VEE +36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, regardless of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage is

within the common mode input voltage range of the electric characteristics.

Connect

to Vicm Vicm

VCC

+

-

VEE

Figure 56. Example of

application circuit for unused op-amp

3) Power supply (single / dual)

The op-amp operates when the voltage supplied is between VCC and VEE.

Therefore, the single supply op-amp can be used as dual supply op-amp as

well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including

reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power

dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal

derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation

or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation in a strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) Radioactive rays

This IC is not designed protection against radioactive rays.

8) IC handling

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical

characteristics due to piezo resistance effects.

9) IC operation

The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected

to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and

charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias

current for Class A operation will suppress crossover distortion.

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that

the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the

assembly process as well as during transportation and storage.

11) Output capacitor

If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor will flow into the

output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor

smaller than 0.1uF between output and GND.

12) Oscillation by output capacitor

Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop

circuit with these ICs.

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TSZ02201-0RAR1G200110-1-2

21.Jan.2013 Rev.002

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