BSP324(2003) View Datasheet(PDF) - Infineon Technologies
Part Name
Description
Manufacturer
BSP324 Datasheet PDF : 8 Pages
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Rev. 1.0
BSP324
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - soldering point
(Pin 4)
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
Symbol
Values
Unit
min. typ. max.
RthJS
RthJA
-
16 25 K/W
-
85 115
-
45 70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=250µA
Gate threshold voltage, VGS = VDS
ID=94µA
Zero gate voltage drain current
VDS=400V, VGS=0, Tj=25°C
VDS=400V, VGS=0, Tj=125°C
V(BR)DSS 400
-
-V
VGS(th)
1.3 1.9 2.3
IDSS
µA
- 0.01 0.1
-
-
10
Gate-source leakage current
VGS=20V, VDS=0
Drain-source on-state resistance
VGS=4.5V, ID=0.05A
Drain-source on-state resistance
VGS=10V, ID=0.17A
IGSS
RDS(on)
RDS(on)
-
10 100 nA
- 14.3 22 Ω
- 13.6 25
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2003-02-21
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