CXA1211 View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

Manufacturer

CXA1211

Electronic Volume

Sony Semiconductor 

Package Outline

Unit: mm

8PIN SOP (PLASTIC)

+ 0.4

5.0 – 0.1

8

5

A

CXA1211M

+ 0.4

1.25 – 0.15

0.10

1

4

1.27

b

0.24 M

B

+ 0.15

0.1 – 0.1

+ 0.1

b = 0.4 – 0.05

(0.4)

b = 0.4 ± 0.03

0° to 10°

DETAILA

DETAIL B : SOLDER

DETAIL B : PALLADIUM

PACKAGE STRUCTURE

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-8P-L03

SOP008-P-0225

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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