CY8C201A0-SX2I(2008) View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
CY8C201A0-SX2I Datasheet PDF : 12 Pages
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CY8C201A0
Ordering Information
Ordering Code
CY8C201A0-LDX2I
CY8C201A0-SX2I
Package Diagram
001-09116
51-85068
Package Type
16 COL[3]
16 SOIC
Operating
Temperature
Industrial
Industrial
Thermal Impedances by Package
Package
16 COL[3]
16 SOIC
Solder Reflow Peak Temperature
Package
16 COL[3]
Minimum Peak Temperature[2]
240 °C
16 SOIC
240 °C
Typical θJA[1]
46 °C
79.96 °C
Maximum Peak Temperature
260 °C
260 °C
Notes
1. TJ = TA + Power x θJA.
2. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
3. Earlier termed as QFN package.
Document Number: 001-17349 Rev. *B
Page 10 of 12
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