DS1254
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
Recommended Land Pattern (with Overlaid Package Outline)
The DS1254 BGA is a subset of the industry-standard 40mm BGA format, with all balls on a 50-mil grid.
Corner balls have been removed to provide space for the electrical and mechanical interface features that
facilitate attachment of the DS3800 battery cap.
NOTE
0.500
0.250
0.150
NOTE: GROUND SHIELD TO ISOLATE RTC XTAL FROM EMI.
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products · Printed USA
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