EL1503A
Typical Performance Curves (Continued)
25
VS = ±12V
20
15
10
5
I S+ (FI SU-ILS(ILFSII+SSU-P+-(L(OT(T(L2E2WE/P/3RR3EOMPRMPWO)IOINENWWARAE)ETTRERE))))
0
0
100
200
300
400
500
ISET (µA)
FIGURE 35. IS vs ISET
25
VS = ±12V
20
15
10
5
IISS-+II(SFS(IIF-U+SSU+(-L(TLT(L(E22LEP/R/3R3POMOPMPWIOWONIENWWAERARTE)ET)ERRE))))
0
0
100
200
300
400
500
ISET (µA)
FIGURE 36. IS vs ISET
4.5
4.0
θJA = 30°C/W
3.5
3.0
2.5
θJA = 43°C/W
2.0
θJA = 53°C/W
1.5
1.0
θJA = 80°C/W
0.5
0
-40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE (°C)
FIGURE 37. POWER DISSIPATION vs AMBIENT
TEMPERATURE for VARIOUS MOUNTED θJAs
POWER DISSIPATION & THERMAL RESISTANCE USING
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD, QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
3.0
2.5
2.703W
2.0
1.5
1.0
0.5
0
0
25
50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 38. POWER DISSIPATION vs AMBIENT
TEMPERATURE
10
FN7039.2
March 26, 2007