FAN5340MPX View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

FAN5340MPX

Synchronous Constant-Current Series Boost LED Driver with PWM Brightness Control and Integrated Load Disconnect

Fairchild Semiconductor 

April 2010

FAN5340

Synchronous Constant-Current Series Boost LED Driver

with PWM Brightness Control and Integrated Load

Disconnect

Features

ƒ Synchronous Current-Mode Boost Converter

ƒ Up to 500mW Output Power

ƒ Supports 2, 3, or 4 LEDs in Series

ƒ 2.7V to 4.8V Input Voltage Range

ƒ 1.2MHz Fixed Switching Frequency

ƒ 1mA Maximum Quiescent Current

ƒ Soft-Start Capability

ƒ Input Under-Voltage Lockout (UVLO)

ƒ Output Over-Voltage Protection (OVP)

ƒ Short-Circuit Detection

ƒ Thermal Shutdown (TSD) Protection

ƒ 8-Lead 3.00 x 3.00mm MLP

ƒ 8-Bump 1.57 x 1.57mm WLCSP

Applications

ƒ Cellular Phones, Smart Phones

ƒ Pocket PCs

ƒ WLAN DC-DC Converter Modules

ƒ PDA, DSC, PMP, and MP3 Players

Description

The FAN5340 is a synchronous constant-current LED driver

capable of efficiently delivering up to 500mW to a string of up

to four LEDs in series. Optimized for small form-factor

applications, the 1.2MHz fixed switching frequency allows

the use of chip inductors and capacitors.

For safety, the device features integrated short-circuit

detection plus over-voltage and thermal shutdown

protections. In addition, input under-voltage lockout

protection is triggered if the battery voltage is low.

Brightness (dimming) control is implemented by applying a

PWM signal of 300Hz to 1kHz on the EN pin. During

shutdown, the FAN5340 disconnects the LED anodes from

the output of the boost regulator, which holds the boost

regulator’s voltage on COUT, reducing audible noise from the

PWM dimming and removing power from the LED string.

GND

VIN

2–4

LEDs

1

EN 2

VLED 3

P1

GND

8

7 VOUT

6 SW

COUT

CIN

FB 4

5 PGND

RSET

Figure 1. Typical Application

Ordering Information

Part Number

FAN5340UCX

FAN5340MPX

(Prelminary)

Operating

Temperature Range

Package

-40 to 85°C

8-Bump, 1.57 x 1.57mm Wafer Level Chip-Scale

Package (WLCSP)

-40 to 85°C

8-Lead, 3.00 x 3.00mm Molded Leadless

Package (MLP)

Packing

Tape and Reel

Tape and Reel

© 2010 Fairchild Semiconductor Corporation

FAN5340 • Rev. 1.0.1

www.fairchildsemi.com

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