H7809ANE View Datasheet(PDF) - Hi-Sincerity Mocroelectronics
Part Name
Description
Manufacturer
H7809ANE Datasheet PDF : 12 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200405
Issued Date : 2004.04.01
Revised Date : 2006.01.19
Page No. : 11/12
SOT-82 Dimension
A
B
C
D
123
r1
r2
L
H
F
E
G
a1
a1
I
J
M
K
a1
N
r3
a1
Marking:
Pb Free Mark
Pb-Free: " . " (Note) H
Normal: None
78
Product Series
N E (05,06,08,09,12)
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Input 2.Ground 3.Output
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead SOT-82
Plastic Package
HSMC Package Code: NE
DIM Min. Max.
A
7.57 7.67
B
5.44 5.54
C
3.78 3.98
D 10.88 10.98
E 10.25 10.75
F
-
*1.27
G
-
*0.76
H
1.16 1.26
I
-
*0.76
J
4.52 4.62
K
2.49 2.59
L
1.10 1.20
M
-
*0.60
N
1.22 1.32
a1
-
*3o
r1
-
φ3.10
r2
-
R1.70
r3
-
R0.20
*: Typical, Unit: mm
TO-220AB Dimension
A
D
B
F
E
H
I
3
G
2
1
Tab
P
L
M
O
J
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
C
Normal: None H
Product Series
E (05,06,08,09,12)
78
Date Code
Control Code
K
Note: Green label is used for pb-free packing
N
Pin Style: 1.Input 2.Ground 3.Output
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
5.58 7.49
B
8.38 8.90
C
4.40 4.70
D
1.15 1.39
E
0.35 0.60
F
2.03 2.92
G
9.66 10.28
H
- *16.25
I
-
*3.83
J
3.00 4.00
K
0.75 0.95
L
2.54 3.42
M
1.14 1.40
N
-
*2.54
O 12.70 14.27
P 14.48 15.87
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE
HSMC Product Specification
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