HA-2539
Die Characteristics
DIE DIMENSIONS:
62 mils x 76 mils x 19 mils
1575µm x 1930µm x 483µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1.5kÅ
Metallization Mask Layout
SUBSTRATE POTENTIAL (POWERED UP):
V-
TRANSISTOR COUNT:
30
PROCESS:
Bipolar Dielectric Isolation
+IN
V-
OUTPUT
V+
-IN
9