H1155I View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

H1155I

380MHz, SOT-23, Low Power Current Feedback Operational Amplifier

Intersil 

Die Characteristics

DIE DIMENSIONS:

53 mils x 25mils

1350µm x 630µm

METALLIZATION:

Type: Metal 1: AlCu (2%)/TiW

Thickness: Metal 1: 8kÅ ±0.4kÅ

Type: Metal 2: AlCu (2%)

Thickness: Metal 2: 16kÅ ±0.8kÅ

Metallization Mask Layout

HFA1155

PASSIVATION:

Type: Nitride

Thickness: 4kÅ ±0.5kÅ

TRANSISTOR COUNT:

40

SUBSTRATE POTENTIAL (POWERED UP):

Floating (Recommend Connection to V-)

HFA1155

V+

OUT

V-

-IN

+IN

11

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