HLMP-DB45-A0000 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
HLMP-DB45-A0000 Datasheet PDF : 6 Pages
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4
10
1
1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02
PULSE WIDTH (SECONDS)
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5 10 15 20 25 30 35
IF – DC FORWARD CURRENT – mA
35
30
25
20
15
10
5
0
0 10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
Figure 4. Forward Current vs.
Forward Voltage.
Figure 5. Relative Luminous Intensity
vs. Forward Current.
Figure 6. Maximum DC Forward
Current vs. Ambient Temperature.
Derating Based on TJ Max. = 115 °C.
10° 0°
20°
1.0
30°
40°
.8
50°
.6
60°
.4
70°
80°
.2
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
Figure 7. Relative Luminous Intensity vs. Angular Displacement
for HLMP-DB25.
10° 0°
20°
1.0
30°
40°
.8
50°
.6
60°
.4
70°
80°
.2
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
Figure 8. Relative Luminous Intensity vs. Angular Displacement
for HLMP-KB45.
Soldering/Cleaning
Cleaning agents from the ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chlorinated hydrocarbon family
(methylene chloride,
trichloroethylene, carbon
tetrachloride, etc.) are not
recommended for cleaning LED
parts. All of these various
solvents attack or dissolve the
encapsulating epoxies used to
form the package of plastic LED
parts.
For information on soldering
LEDs, please refer to Application
Note 1027.
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