HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200103
Issued Date : 2001.12.01
Revised Date : 2005.12.02
Page No. : 3/4
TO-126 Dimension
D
A
J
M
B
123
NK
C
G
F
H
L
3-Lead TO-126
Plastic Package
HSMC Package Code: T
Marking:
H
SB
649T
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
3.60 4.40
B
6.90 7.60
C 13.00 16.50
D
7.20 8.50
F
0.65 0.88
G
1.00 1.42
H
4.52 4.62
J
1.14 1.50
K
0.90 1.50
L
0.45 0.60
M
2.92 3.40
N
2.00 2.70
Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB649T
HSMC Product Specification