Pin Assignment
HT9200A/B
Pad Assignment
Pad Coordinates
Unit: µm
Pad
No.
X
Y
Pad
No.
X
Y
1 –553.30 430.40 8 553.30 –523.50
2 –553.30 –133.50 9 553.30 –190.30
3 –553.30 –328.50 10 553.30 4.70
4 –553.30 –523.50 11 553.30 340.30
5 –220.10 –523.50 12 374.90 523.50
6 –25.10 –523.50 13 –279.30 523.50
7 308.10 –523.50
Chip size: 1460 × 1470 (µm)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pin Description
Pin Name
I/O
Internal
Connection
Description
CE
I
CMOS IN
Pull-high
Chip enable, active low
X2
O
The system oscillator consists of an inverter, a bias resistor, and
X1
I
Oscillator
the required load capacitor on chip.
The oscillator function can be implemented by Connect a
standard 3.579545MHz crystal to the X1 and X2 terminals.
VSS
NC
—
—
Negative power supply
—
—
No connection
2
21st Aug ’98