ISD5008EI View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

ISD5008EI

SINGLE-CHIP, VOICE RECORD / PLAYBACK DEVICE 4-, 5-, 6- AND 8-SECOND DURATION

Winbond 

ISD5008 Product

(1)

Figure 24: ISD5008 Series Bonding Physical Layout (Unpackaged Die)

MOSI

MISO

VSSD

V

SSD

SS

SCLK

VCCD

V

CCD

XCLK

INT

RAC

VSSA

ISD5008 Series

I. Die Dimensions

X: 166.5 ±1 mils

Y: 302.4 ±1 mils

(3)

II. Die Thickness

11.5 ±1.0 mils

III. Pad Opening (min)

90 x 90 microns

3.5 x 3.5 mils

ISD5008

VSSA

MIC+

MIC–

ANAOUT+

ANAOUT– ACAP

AUXOUT

AUX IN

ANA IN

(2)

(2)

VCCA

SP– V

SP+

SSA

1. The backside of die is internally connected to V SS. It MUST NOT be connected to any other potential or damage

may occur.

2. Double bond recommended.

3. This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.

ISD

39

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