DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

LT3518HFE(RevB) View Datasheet(PDF) - Linear Technology

Part Name
Description
Manufacturer
LT3518HFE
(Rev.:RevB)
Linear
Linear Technology 
LT3518HFE Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT3518
PACKAGE DESCRIPTION
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
0.72 ±0.05
4.35 ± 0.05
2.15 ± 0.05
2.90 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.30 ±0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
2.15 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
0.55 ± 0.20
1
2
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UF16) QFN 1004
0.30 ± 0.05
0.65 BSC
3518fb
18

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]