WS512K32-17G1TMA View Datasheet(PDF) - White Electronic Designs => Micro Semi
Part Name
Description
Manufacturer
WS512K32-17G1TMA Datasheet PDF : 11 Pages
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WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400).
68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140")
(Package 502)1, Package to be developed.
68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).
68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square
(Package 524) 4.06mm (0.160") height.
n Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8
n Commercial, Industrial and Military Temperature Ranges
n TTL Compatible Inputs and Outputs
n 5 Volt Power Supply
n Low Power CMOS
n Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
n Weight
WS512K32-XH1X - 13 grams typical
WS512K32-XG2TX1 - 8 grams typical
WS512K32-XG1UX - 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX1 - 20 grams typical
* 15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
Note 1: Package Not Recommended For New Design
FIG. 1 PIN CONFIGURATION FOR WS512K32N-XH1X
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18 Address Inputs
WE1-4 Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
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