MF-MSMD125(2004) View Datasheet(PDF) - Bourns, Inc
Part Name
Description
Manufacturer
MF-MSMD125 Datasheet PDF : 4 Pages
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Additional Features
■ Patents pending
MF-MSMD Series - PTC Resettable Fuses
Product Dimensions
Model
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
Packaging: 2000 pcs. per reel.
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
B
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
C
Min.
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.56
(0.022)
0.38
(0.015)
0.38
(0.015)
0.38
(0.015)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.25
(0.010)
Max.
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.81
(0.032)
0.62
(0.024)
0.62
(0.024)
0.62
(0.024)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
0.48
(0.019)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT = MM
(INCHES)
Top and Bottom View
A
Side View
C
B
D
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
2.70 ± 0.1
(.106 ± .004)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
Terminal material: solder-plated copper
Termination pad solderability: Meets EIA
Specification RS-186-9E, ANSI/J-STD-002
Category 3.
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
250
200
150
100
50
0
160–220
10–20
120
Time (seconds)
Note:
• MF-MSMD models can be wave soldered and reworked.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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