NCP3012 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NCP3012 Datasheet PDF : 26 Pages
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NCP3012
ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted)
High Side Drive Boost Pin
Rating
Symbol
BST
VMAX
45
VMIN
−0.3
Unit
V
Boost to VSW differential voltage
COMP
BST−VSW
13.2
−0.3
V
COMP
5.5
−0.3
V
Enable
EN
5.5
−0.3
V
Feedback
FB
5.5
−0.3
V
High−Side Driver Output
HSDR
40
−0.3
V
Low−Side Driver Output
LSDR
13.2
−0.3
V
Power Good
PG
5.5
−0.3
V
Synchronization
SYNC
5.5
−0.3
V
Main Supply Voltage Input
External Reference
VCC
VREF
40
−0.3
V
5.5
−0.3
V
Switch Node Voltage
Maximum Average Current
VCC, BST, HSDRV, LSDRV, VSW, GND
REF
EN
SYNC
PG
VSW
Imax
40
−0.6
V
mA
130
7.1
2.5
11
4
Operating Junction Temperature Range (Note 1)
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics (Note 2)
TSSOP−14 Plastic Package
Thermal Resistance Junction−to−Air
Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free
(Note 3)
TJ
TJ(MAX)
Tstg
RqJA
RF
−40 to +140
+150
−55 to +150
190
260 Peak
°C
°C
°C
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
TJ(max) * TA
PD +
RqJA
2. When mounted on minimum recommended FR−4 or G−10 board
3. 60−180 seconds minimum above 237°C.
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