NCP3020A, NCP3020B, NCV3020A, NCV3020B
ELECTRICAL CHARACTERISTICS (−40°C < TJ < +125°C, VCC = 12 V, for min/max values unless otherwise noted)
Characteristic
Conditions
Min
Typ
Max
Unit
GATE DRIVERS AND BOOST CLAMP
HSDRV Pullup Resistance
TJ = 25°C, VCC = 8 V, VBST = 7.5 V, VSW = GND
5.0
11
20
W
100 mA out of HSDR pin
HSDRV Pulldown Resistance
TJ = 25°C, VCC = 8 V, VBST = 7.5 V, VSW = GND
2.0
5.0
11.5
W
100 mA into HSDR pin
LSDRV Pullup Resistance
TJ = 25°C, VCC = 8 V, VBST = 7.5 V, VSW = GND
5.0
9.0
16
W
100 mA out of LSDR pin
LSDRV Pulldown Resistance
TJ = 25°C, VCC = 8 V, VBST = 7.5 V, VSW = GND
1.0
3.0
6.0
W
100 mA into LSDR pin
HSDRV Falling to LSDRV Rising
Delay
VIN = 12 V, VSW = GND, VCOMP = 1.3 V
50
80
110
ns
LSDRV Falling to HSDRV Rising
Delay
VIN = 12 V, VSW = GND, VCOMP = 1.3 V
60
80
120
ns
Boost Clamp Voltage
THERMAL SHUTDOWN
Thermal Shutdown
VIN = 12 V, VSW = GND, VCOMP = 1.3 V
5.5
7.5
9.6
V
(Notes 4 and 7)
−
165
−
°C
Hysteresis
(Notes 4 and 7)
−
20
−
°C
4. Guaranteed by design.
5. The voltage sensed across the high side MOSFET during conduction.
6. This assumes 100 pF capacitance to ground on the COMP Pin and a typical internal Ro of > 10 MW.
7. This is not a protection feature.
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